Microwave Journal Podcasts

Pat Hindle and Del Pierson talk with Juan Montojo, VP of Technical Standards and Qualcomm's 3GPP lead, about 3GPP Release 20 including the overall goals and technologies that will be covered and the timing of the release.

Microwave Journal editors Pat Hindle and Del Pierson review the July issue articles, interview TMYTEK about reconfigurable intelligent surfaces technology and cover industry news and events. Sponsored by RFMW and TMYTEK.

Microwave Journal editors Pat Hindle and Del Pierson are joined by special guest Joe Dussi from Infineon Hi Rel to discuss the July AI, Software and Test issue articles, the satellite/space market and IMS 2025. Sponsored by RFMW.

Pat Hindle and Del Pierson talk with Rob Smith, Vice President, Radio Frequency Solutions at Raytheon, the new PhantomStrike radar,  a lightweight, affordable, compact radar for any platform that is about half the weight and cost of traditional AESA radar systems. It is aimed at SWAP challenged platforms such as UAVs, rotary wing aircraft or lightweight/training fighters.

Microwave Journal editors Pat Hindle and Del Pierson cover the June Aerospace and Defense supplement articles/products, industry news and IMS 2025. Sponsored by Mini-Circuits.

Microwave Journal editors Pat Hindle and Del Pierson cover the June Semiconductor/RFIC themed issue articles, Industry News and IMS 2025. Sponsored by RFMW.

Irena Goloschokin, CEO of Copper Mountain Technologies, talks with Pat Hindle about separating their operations from Russia and onshoring their operations along with their strategy to innovate VNA products for the test/measurement market.

Microwave Journal editors Pat Hindle and Del Pierson review the Space and Satellite content in the May IMS plus Space and Satellite themed issue along an ADI interview on the space market plus industry news and IMS 2025 event. Sponsored by RFMW and Analog Devices.

Tom Kole, VP of Sales and Marketing at Integra Technologies, talks with Pat Hindle and Del Pierson of Microwave Journal about new developments and applications for high voltage GaN devices and how the technology is shaping the RF power amplifier market. Sponsored by Integra Technologies.

Visit Integra Technologies at booth #1766 to meet system architects and discuss how Integra’s groundbreaking HV GaN/SiC solutions can help you rearchitect your system to maximize SWaPC2 benefits. And don't miss out on visiting them at the Richardson RFPD booth #348, where you can gain further insights and connect with our experts.

Microwave Journal editors Pat Hindle and Del Pierson discuss the articles in the May IMS plus Space and Satellite themed issue, interview Tom Kole from Integra Technologies about HV GaN, and review industry news/events. Sponsored by RFMW and Integra Technologies.