Microwave Journal editors Pat Hindle and Gary Lerude review the Oct passive and control components issue, news and EuMW2019 event.

Microwave Journal editors Pat Hindle and Gary Lerude review EuMW products at the event and talk with David Vye of NI/AWR & Eric LeClerc of UMS about their collaboration on GaN device modeling/simulation. Sponsored by NI/AWR.

Microwave Journal editors Pat Hindle and Gary Lerude cover the Sept Military Microwaves articles, 5G & WiFi news, and EDI CON Online and EuMW events.

Microwave Journal editors Pat Hindle and Gary Lerude discuss the Sept issue articles including high voltage GaN, 5G news and EuMW/EDI CON Online events. Sponsored by MACOM.

Microwave Journal editors Pat Hindle and Gary Lerude cover the EuMW issue products, Integra Technologies high voltage GaN technology, 5G/Huawei news and EDI CON Online. Sponsored by Integra Technologies.

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Microwave Journal editor Pat Hindle talks with Tom Kole, VP of Sales & Marketing, and Gabriele Formicone, Director of Technology & Innovation, of Integra Technologies about their unique high voltage GaN technology to replace VED devices for very high power applications.
 
 

Microwave Journal editors Pat Hindle and Gary Lerude review the EuMW August issue technical articles, 5G/MACOM news and EDI CON Online event.

Microwave Journal editors Pat Hindle and Gary Lerude talk with founder of SAGE Millimeter, Youghui Shu, about the company's history and introduction of a new waveguide connector system, Uni-Guide, that could be used industry wide.

Microwave Journal editors Pat Hindle and Gary Lerude discuss the July Softwave/Design issue products, interview SAGE Millimeter founder, Youghui Shu, and review latest industry news/events.

Microwave Journal editors Pat Hindle, Gary Lerude and Ashleigh West cover the July Design/Software issue, 5G news, new web site features and events.

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