Microwave Journal Podcasts

NXP experts, Rob Hoeben, Head of Marketing Smart Antenna Solutions, and Doeco Terpstra, VP and General Manager Smart Antenna Solutions, join Microwave Journal editorial director, Pat Hindle, to discuss WiFi 6E features, device design challenges and future WiFi 7 standard.

Telecom consultant Doug Dawson discusses the capabilities of broadband access technologies in this episode of the Frequency Matters podcast.

Microwave Journal editors Pat Hindle and Gary Lerude review the products from the May 5G and IMS issue plus the latest news and events including the IMS2021 hybrid conference and exhibition. Sponsored by RFMW.

Kevin Hietpas, Product Line Manager for Antennas at Pasternack, talks with Microwave Journal editors, Pat Hindle and Gary Lerude, about the 5G sub 6 GHz antenna market, proper antenna selection and future trends for antenna technology. Sponsored by Pasternack.

5G Americas president, Chris Pearson, talks with Microwave Journal editor Pat Hindle about the status of 5G deployments and how 5G is enabling the automotive and manufacturing sectors.

Microwave Journal^® launches a new podcast series, "RF Industry Icons," and in the second episode we talk with Les Besser, inventor of COMPACT (Computerized Optimization of Microwave Passive and Active CircuiTs) software, the first commercially available circuit simulation software, and founder of the RF training company, Besser Associates. COMPACT software was ultimately sold to Ulrich Rohde and acquired by Ansoft which is now owned by Ansys. Learn about this evolution of RF simulation software as told through Les Besser's story.

Microwave Journal editors Pat Hindle and Gary Lerude talk with William Webb, CTO and James Childs, VP of Business Development and Strategy for Cambridge Broadband Networks Group representing the 5G for 12 GHz Coalition. They discuss the Coalition's mission, why the 12 GHz band is critical for mid-band capacity and expected outcome of the FCC review.

Integra Technologies VP of Sales and Marketing talks with Microwave Journal Editors Pat Hindle and Gary Lerude about the high power transistor market and their new innovative modular solution that offers plug and play pallet solutions. Sponsored by Integra Technologies.

Microwave Journal Editors Pat Hindle and Gary Lerude cover the May 5G and IMS issue articles, talk with Integra Technologies VP of Sales and Marketing, Tom Kole, and review industry news and events. Sponsored by Integra Technologies.

Microwave Journal Editorial Director Pat Hindle talks with Analog Devices Vice President of Wireless Communications Joe Barry about the status of Open RAN plus the challenges and opportunities of network disaggregation.