Microwave Journal Podcasts

In this part 2 of design challenges for 5G, Molex experts Roger Kauffman, Senior Director of Product Management and Marketing, and William Spink, Global Director of Engineering talk with Microwave Journal editors Pat Hindle and Gary Lerude about the rollout of 5G sub 6 GHz versus mmWave and the performance needs versus cost for these markets. View the Molex 5G Technology Site. You can find previous episodes of the Molex 5G Podcast series here.

Microwave Journal editors Pat Hindle and Gary Lerude review the Jan Radar and Antenna themed issue technical articles plus take a look at the virtual events this past week, EuMW and CES 2021. See what products they like from CES and their review of EuMW. Sponsored by RFMW and Sivers Semiconductors.

Microwave Journal editors Pat Hindle and Gary Lerude review low cost test instruments to give your favorite RF/microwave engineer in their annual holiday episode plus review news and events. Sponsored by WTG and RFMW.

Microwave Journal editors Pat Hindle and Gary Lerude discuss the Dec issue cover development focused on Gov't/Military Electronics theme and EuMW Show issue plus cover technical features, EuMW 2020 and industry news.

Stephen Drinan, Director of Core Products for Antennas & Micro Solutions at Molex, joins Microwave Journal editors, Pat Hindle and Gary Lerude, to discuss the current rollout of 5G networks and the design challenges for mobile devices including the antenna design. This is part one of a three part series with Molex experts discussing the challenges and solutions for 5G technologies. We thank Molex for sponsoring this intriguing series. View the Molex 5G Technology Site. You can find previous episodes of the Molex 5G Podcast series here.

Microwave Journal editors Pat Hindle and Gary Lerude cover the Oct Passive/Control Components issue technical articles, interview with Mini-Circuits Test/Meas. VP (Chi Man Shum) plus the latest on industry news and events.

Microwave Journal editors Pat Hindle and Gary Lerude cover the technical articles in the Sept mmWave Components and Packaging issue, 5G/SATCOM news and upcoming events. Sponsored by WTG and RFMW.

David Hall, Go-to-Market Director - Head of Semiconductor Marketing at NI, and Sam Kim, Vice President and General Manager at RFHIC, talk with Microwave Journal editors Pat Hindle and Gary Lerude about how engineering ambition can be scary but rewarding as they discuss the development effort of kW GaN on diamond transistors.

In the fourth episode of our series of podcasts exploring Innovative IoT applications using wireless technology, we learn about Smart Cities and Qualcomm's role in helping companies innovate new applications. Sanjeet Pandit, Global Head of Smart Cities at Qualcomm, joins Microwave Journal editors Pat Hindle and Gary Lerude to discuss the state of Smart City technology around the world and it’s future evolution.

Microwave Journal editors Pat Hindle and Gary Lerude cover the August Trends in Test and Measure issue technical articles, industry news and IMS2020 virtual event. Sponsored by RFMW and Wireless Telecom Group.