Microwave Journal Podcasts

Dan Green, Senior Technical Director at Analog Devices, talks with Pat Hindle about chiplet technology, how the landscape has changed and where the technology is heading. Sponsored by Analog Devices.

Microwave Journal editors Pat Hindle and Del Pierson discuss the September Automotive and Connected Vehicles issue articles, Interview ADI about chiplet technology and review industry news/events. Sponsored by RFMW and Analog Devices.

Wolfgang Wendler and Ezer Bennour, both Product Managers at Rohde & Schwarz, discuss the new applications for the new FSWX, the first signal and spectrum analyzer with 2 synchronous inputs, and the updated FSWP phase noise analyzer.

Microwave Journal editors Pat Hindle and Del Pierson talk with Shola Efunshile, COO at UNIVITY about developing a shared, neutral, and fully independent space infrastructure that enables telecom operators worldwide to deploy high-speed, low-latency internet access from space to complement terrestrial networks. The constellation operates in Very Low Earth Orbit using telecom operators’ 5G mmWave spectrum and is environmentally conscious so has some unique features that are covered in this podcast.

Microwave Journal editors Pat Hindle and Del Pierson review the articles in the mmWave Special Focus section, EuMW 2025 and industry news/events. Sponsored by Mini-Circuits - check out their mmWave amps at https://www.minicircuits.com/WebStore/Amplifiers_Millimeter_Wave.html.

0:45 mmWave Special Focus Section

2:16 mmWave Amplifiers

3:20 Industry News

5:45 Industry Events

Pat Hindle and Del Pierson talk with Shankaran Janardhanan, SVP of RF Product Line at GlobalFoundries, about RF a key enabler of on-device AI and the future of RF semiconductor technology. 

Microwave Journal editors Pat Hindle and Del Pierson review the August EuMW and mmWave themed issue articles along with the latest industry news and events. Sponsored by RFMW.

Pat Hindle and Del Pierson talk with Juan Montojo, VP of Technical Standards and Qualcomm's 3GPP lead, about 3GPP Release 20 including the overall goals and technologies that will be covered and the timing of the release.

Microwave Journal editors Pat Hindle and Del Pierson review the July issue articles, interview TMYTEK about reconfigurable intelligent surfaces technology and cover industry news and events. Sponsored by RFMW and TMYTEK.

Microwave Journal editors Pat Hindle and Del Pierson are joined by special guest Joe Dussi from Infineon Hi Rel to discuss the July AI, Software and Test issue articles, the satellite/space market and IMS 2025. Sponsored by RFMW.